- +123 456 789 00
- info@nvidioso.com
At NVIDIOSO, we offer a full spectrum of Assembly, Testing, and Packaging (ATP) services tailored to meet the demands of modern semiconductor applications. From wafer probe testing to System-in-Package (SiP) solutions, our capabilities are engineered to ensure efficiency, accuracy, and international compliance at every stage. Whether you’re developing next-gen AI chips or advanced automotive components, we’re equipped to support your success—right here in Mexico.
An OSAT (Outsourced Semiconductor Assembly and Test) provider specializes in packaging and testing semiconductor chips after fabrication. This step is critical in ensuring the functionality, reliability, and performance of chips before they are integrated into electronic devices.
We serve a wide range of high-tech industries, including artificial intelligence, automotive, consumer electronics, telecommunications, and industrial automation—anywhere that demands high-performance semiconductor solutions.
Our headquarters is in Guadalajara, Mexico, a strategic location offering proximity to North American markets, a skilled workforce, competitive manufacturing costs, and the benefits of free trade agreements like USMCA.
Yes. We work closely with our clients to provide tailored ATP solutions, including support for advanced packages like Flip Chip and SiP, as well as AI-driven simulation and digital twin technologies.
